AMAOE MU2 0.12mm MTK CPU BGA Reballing Stencil

AMAOE MU2 0.12mm MTK CPU BGA Reballing Stencil

β‚Ή179.00
Brand:
Model: MU-2
Availability: In Stock
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Product Description

The AMAOE MU2 0.12mm MTK CPU BGA Reballing Stencil is designed for MediaTek processor reballing and mobile motherboard repair. It supports multiple MTK chipset layouts used in compatible smartphones.

Key Features

  • Brand: AMAOE
  • Model: MU2
  • Thickness: 0.12mm
  • Material: Japanese steel sheet
  • Type: MTK CPU BGA reballing stencil
  • Supported Chipsets: MT6582, MT6735, MT6589, MT6572A, MT6580A and MT6755
  • Application: CPU reballing and smartphone motherboard repair

The stencil helps technicians align solder balls or solder paste with the matching BGA pad layout during CPU rework.

Compatibility Note: Check the processor marking and BGA layout before use to ensure the stencil matches the chip being repaired.

🚚 Shipping & Delivery Information

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